Introduction: Solderless Breadboard withh 400 tie point. It has 2 power buses, 10 columns, and 30 rows. All pins are spaced by a standard 0.1". The two sets of five columns are separated by about 0.3", perfect for straddling a DIP package over. The board accepts wire sizes in the range of 29-20AWG.
Features:
- Dimensions: 3.29 x 2.15 x 0.33" (83.5 x 54.5 x 8.5mm)
- Self Adhesive.
Datasheet:
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